LG LG 1200B free download

File name Assembly instructions.pdf

6. ASSEMBLY INSTRUCTIONS 6. ASSEMBLY INSTRUCTIONS 1. Remove battery cover - 41 - 6. ASSEMBLY INSTRUCTIONS 2. Remove battery - 42 - 6. ASSEMBLY INSTRUCTIONS 3. Remove screws 4. Turn handset up - 43 - 6. ASSEMBLY INSTRUCTIONS 5.Take off front panel 6.Take off keypad - 44 - 6. ASSEMBLY INSTRUCTIONS 7.Take off mainboard - 45 - 6. ASSEMBLY INSTRUCTIONS 8. Take off MIC and backup battery 9. Turn mainboard down - 46 - 6. ASSEMBLY INSTRUCTIONS 10. Take off Antenna - 47 - 6. ASSEMBLY INSTRUCTIONS 11. Take off Shielding cover - 48 - 6. ASSEMBLY INSTRUCTIONS 12. Take off Vibrator and BATT connector - 49 -

File name Block diagram.pdf

7. BLOCK DIAGRAM 7. BLOCK DIAGRAM 1) BaseBand Section - 50 - 7. BLOCK DIAGRAM 2) RF Section - 51 - 7. BLOCK DIAGRAM - 52 -

File name Exploded view.pdf

11. EXPLODED VIEW & REPLACEMENT PART LIST 11. EXPLODED VIEW & REPLACEMENT PART LIST 11-1 Exploded View - 61 - 11. EXPLODED VIEW & REPLACEMENT PART LIST < Parts List of Exploded View > No M1 M2 Location No. LG Part No. MWAC0019201 MHDA0005501 MHDA0005502 MHDA0005503 M3 M4 M5 M6 M7 M8 M9 M10 M11 M12 LS301SUSY0006501 MKAA0004601 SUMY0004301 SBCL0001101 SNGF0000901 SAFY0054401 MPBZ0014801 J103ENTB0003601 MHDB0005401 MHDB0005402 MHDB0005403 M13 M14 M15 SBPL0064501 MCJA0003401 MCJA0003402 MCJA0003403 M16 MHGD0001301 GVC Part No. R3870160R0 R2710267R0 R2710268R0 R2710266R0 HJ00118040 R3630096G0 R3920058G0 HJ110043C0 R383003180 R3930027H0 84044599 R400001580 R3010216M0 R2720177R0 R2720178R0 R2720176R0 R3220063U0 JB040094A0 R2770018R0 R2770019R0 R2770017R0 R385003400 Description LCD Lens Upper Case Upper Case Upper Case Speaker/Receiver/Buzzer 6x2.2OB-2 Sponge for LCM Keypad Rubber Metal Dome MICROPHONE & RUBBER Backup Battery 3V 1.8mAh VL621 ANTENNA EMBEDDED(IN BUILD) Main Board + Key Board (Main PCB Ass'y) Vibrator Battery Connector Lower Case Lower Case Lower Case Screws Battery pack Battery Cover Battery Cover Battery Cover LCM Metal Sheet 39.4x36.3x0.2t(LCM cap) Keypad Rubber 6x2.2 OB-22S42-C1033 DUAL 3V 5mAh Internal Antena Main Board + Key Board 15x8mm Battery Connector (Cobalt Blue) (Titanium) (Red) M1.6x4mm 600mAh Li-Ion (Cobalt Blue) (Titanium) (Red) 39.4x36.3x0.2t Specification LCD Window (Cobalt Blue) (Titanium) (Red) Speaker/Receiver/Buzzer 6x2.2OB-2 Service Y Y Y Y Y N Y Y Y Y Y Y Y Y Y Y N Y Y Y Y Y - 62 - 11. EXPLODED VIEW & REPLACEMENT PART LIST 11-2 Accessories Travel Adapter Portable Handsfree < Accessories > ITEM 1 2 Location No. LG Part No. SGEY0003001 SSAD0011301 GVC Part No. JZ01008960 JB100133C0 Description Headset Switching Travel Charger, (Round Pin) RUS Ver. Specification Ear micro phone Europe Version (Round Pin) RUS Ver. Service Y Y - 63 - 11. EXPLODED VIEW & REPLACEMENT PART LIST 11-3 Replacement Part List ITEM 1 U301 U202 U201 U601 U602 U302 U603 Q101 U604 Z601 U101 Q602 Q301 Q603 Q302 Q601 D103, D201 D313 D102 D601, D602 D301, D302, D303, D304, D304, D307, D308 D309, D310, D311, D312 Y201 Y601 Y602 R317, R318 R309 R605 R314, R637 R640 R209, R211, R315 R111 R629 R305 R613, R602 R208, R217 R633, R631 R614, R316 R606 R102, R204 R601 R112, R604 R216 R634 R609, R610 R301, R608 R110, R319 R306 R304 EDLH0006703 EXXY0016101 EXSC0005501 EXSK0003301 EL500257K0 EM432762T0 EMA0001410 EN913003L0 FM000330D0 FM00039010 FM01022210 FM21010110 FM21010210 FM210103D0 FM210104D0 FM210105D0 FM21012210 FM210122D0 FM210124D0 FM210150D0 FM210152D0 FM210182D0 FM210203D0 FM210221D0 FM210222D0 FM21027110 FM21027210 FM210330D0 FM210332D0 FM210470D0 FM21047210 FM21047310 LED LTST-S220KGKT Green (LITEO X'TAL 32.768KHZ MS1V-TK 20PPM VCO VON1885C28DKB (SAMSUNG) CHIP RES 1/8W 5% 33ohm 2012 CHIP RES 1/8W 5% 39ohm 2012 Y CHIP RES 1/10W 5% 2.2K 1608 YA CHIP RES 1/16W 5% 100ohm 1005 CHIP RES 1/16W 5% 1K 1005 CHIP RES 1/16W 5% 10K 1005 CHIP RES 1/16

File name Failure list_Trouble shooting.pdf

3. FAILURE LIST 3. FAILURE LIST FAILURE ITEM NO RING TONE RING TONE DISTORTION NO KEY TONE AUDIO NOISE POOR VOICE QUALITY LOW VOICE VOLUME RECEIVER / EARPIECE MUTE POOR HANDFREE VOICE QUILITY TOTALLY DEAD/NO POWER UNEXPECTED POWER ON UNEXPECTED POWER OFF / POWER OFF BY PLUG IN A EARPIECE RANDOM TIME DISPLAY CLOCK RESET AT POMER ON / CLOCK DEAD NO SERVE FOUND/NO NET WORK REGISTER ROAMING AT POWER ON / UNEXPECTED INTERNATIONAL ROAMING WRONG IMEI CODE LCD NOT DISPLAY LCD DISPLAY MISSING ROW/LCD DISPLAY DETECT BLACK LCD FLICKING LCD DISPLAY / DISPLAY UNSTABLE BLACK LINE ON LCD DISPLAY RANDOM LCD DISPLAY LED FAIL WEAK SINGAL/ECHO IN TALKS NO TRANSMIT / RECEIVE ANTENNA DEFECT INCOME CALLS CAN'T BE PICKED UP REMOTE SIDE AUDIO MUTE SIGNAL INTERCEPT BAD CHARGER CONNECTOR CAN'T POWER ON AFTER CHARGING SHORT WAITING HOURS HIGH POWER CONSUMATION BATTERY DAMAGE BATTERY CAN'T BE CHARGED BATTERY LEVEL DON'T DISPLAY BATTERY LEVEL DISPLAY NOT CORRECT INCOMPATIBLE WITH BATTERY SIM CARD UNRECOGNIZE BAD SIM CARD CONTACT UNEXPECTED SIM CARD LOCK HOUSING DAMAGE BAD KEYPAD RESPONSE L1 L2 V V V V V V V V V L3 V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V V - 30 - 4. TROUBLE SHOOTING 4. TROUBLE SHOOTING Power Supply Failure a) Failure : - Problem with turning on mobile phone Solution: - Test the set's current by using battery simulator: observe the value of current used - Case 1: If the Current is higher than 300mA, please check C223~C227, if short circuit, Replace it. - Case 2: In the case the current is between 10 and 30mA, The cause could be FLASH ROM(U301) defect, please use monitor to re-install software. If the software can't be re-install through serial port, use JTAG interface to re-install software. b) Failure : - Problem with charging the battery - Charging connector damage Solution : - J104 may be bad connection or broken, check the connector. - J104 may be a cold soldering, Please re-solder again. - If J104 is broken, replace the connector carefully c) Failure : - The value of the charging current look like short circuit. Solution : - Re-install the software - Check Q101, if short circuit, replace it. - 31 - 4. TROUBLE SHOOTING Software Download Failure a) Failure : - Problem with software download Solution : - J104 may be bad connection or broken, check the connector. - J104 may be a cold soldering, Please re-solder again. - Check R104,R105& R109, if cold soldering, Please re-solder again. Voice Function Failure a) Failure : - Microphone voice failure Solution : - Check M301, the microphone holder may be bad connection - Test the bias voltage on R301, it should be 2.5V, - Replace Microphone, if microphone holder & bias voltage is fine. b) Failure : - Speaker failure Solution : - check speaker connector, it may be bad connection. - Check U302 and related circuit, if short circuit, replace it. c) Failure : - Headset function failure Solution : - J104 may be bad connection or broken, check the connector. -

File name LG-B1200_Russia_Russian.pdf

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File name Performance.pdf

1. PERFORMANCE 1. Performance MODEL NAME Talk time Standby RF power output B1200 140 mins 50 - 120 hours Class 4 GSM/ Class 1 DCS Transmitting Frequency Range: Receiving Frequency Range: TX - RX Duplex Spacing: Channel Spacing: Number of Channels: GSM PCN GSM PCN GSM GSM GSM PCN : 890 - 915 Mhz : 1710 - 1785 Mhz : 935 - 960 Mhz : 1805 - 1880 Mhz : 45 MHz / PCN: 95Mhz : 200 Khz / PCN: 200 Khz : 124 (Numbered 1 to 124) : 374 (Numbered 512 to 885) -2- 1. PERFORMANCE 1-1 PERFORMANCE Item 1 Description Frequency Band Specification EGSM900 band Tx: 890 + n*0.2 MHz Rx: 935 + n*0.2 MHz (n = 0 ~ 124) Tx: 890 + (n-1024)*0.2 MHz Rx: 935 +(n-1024)*0.2 MHz (n = 975 ~ 1023) GSM1800 band Tx: 1710 + (n-512)*0.2 Rx: 1805 + (n-512)*0.2 (n = 512 ~ 885) RMS < 5 degrees Peak < 20 degrees < 0.1ppm ~ =90 Hz (for GSM900) or 180 Hz (for GSM1800) GSM900 Control Level Power level 5 33 dBm 6 31 dBm 7 29 dBm 8 27 dBm 9 25 dBm 10 23 dBm 11 21 dBm 12 19 dBm 13 17 dBm 14 15 dBm 15 13 dBm 16 11 dBm 17 9 dBm 18 7 dBm 19 5 dBm GSM1800 Control Level Power Level 0 30 dBm 1 28 dBm 2 26 dBm 3 24 dBm 4 22 dBm 5 20 dBm 6 18 dBm 7 16 dBm 8 14 dBm 9 12 dBm 10 10 dBm 11 8 dBm 12 6 dBm 13 4 dBm 14 2 dBm 15 0 dBm 2 3 4 Phase error Frequency error Power Level Tolerance ±2dB ±3dB ±3dB ±3dB ±3dB ±3dB ±3dB ±3dB ±3dB ±3dB ±3dB ±5dB ±5dB ±5dB ±5dB Tolerance ±2dB ±3dB ±3dB ±3dB ±3dB ±3dB ±3dB ±3dB ±3dB ±4dB ±4dB ±4dB ±4dB ±4dB ±5dB ±5dB -3- 1. PERFORMANCE Item 5 Description Spectrum due to modulation 6 Spectrum due to switching transient 7 8 Spurious emissions Bit Error Rate 9 Rx Level Report accuracy 10 SLR Specification GSM900 Offset from Carrier (KHz). Max. dBc 100 +0.5 200 -30 250 -33 400 -60 600 ~ <1200 -60 1200 ~ <1800 -60 1800 ~ <3000 -63 3000 ~ <6000 -65 6000 -71 GSM1800 Offset from Carrier (KHz). Max. dBc 100 +0.5 200 -30 250 -33 400 -60 600 ~ <1200 -60 1200 ~ <1800 -60 1800 ~ <3000 -65 3000 ~ <6000 -65 6000 -73 GSM900 Offset from Carrie(KHz). Max. dBm 400 -19 600 -21 1200 -21 1800 -24 GSM1800 Max. dBm Offset from Carrie(KHz). 400 -22 600 -24 1200 -24 1800 -27 Conduction, Emission Status, Appendix 1 Conduction, Emission Status, Appendix 2 GSM900 BER(Class II) <2.439% @-102dBm DCS1800 BER(Class II) <2.439% @-102dBm GSM900 GSM1800 -88 -86 2 2 -101 -99 3 2 < -101 < -99 4 2 8 +/- 3 dB -4- 1. PERFORMANCE Item 11 Description Sending Response Specification Frequency(Hz) Max.(dB) Min.(dB) 100 -12 200 0 300 0 -12 1,000 0 -6 2,000 4 -6 3,000 4 -6 3,400 4 -9 4,000 0 2 +/- 3 dB Frequency(Hz) Max.(dB) Min.(dB) 100 -12 200 0 300 2 -7 500 * -5 1,000 0 -5 3,000 2 -5 3,400 2 -10 4,000 2 * Mean that Adopt a straight line in between 300Hz& 1,000Hz to be Max. level in the range. 13 +/- 5 dB > 6 dB dB to ARL (dB) Level Ratio (dB) -35 17.5 -30 22.5 -20 30.7 -10 33.3 0 33.7 7 31.7 10 25.5 Three stage distortion < 10% 2.5ppm 30ppm Full power: < 280mA (GSM) ; < 220mA (DCS) Standby : Normal : <=5mA GSM/ Level_7 (Battery Capacity 650mA): 180Min Under conditions, at least 100 hou

File name Technical brief.pdf

2. TECHNICAL BRIEF 2. TECHNICAL BRIEF 2-1 The RF Chipset The A316 RF integrates the TRF6150 transceiver IC, TX/RX VCO, Power amplifier(RF3110), Front End Module 8450T(switchplexer, RF-SAW filter), for dulaband transmitting and receiving function. 32KHz QUARTZ VCOs - 11 - 2. TECHNICAL BRIEF 2-1-1 The Receiver The RF receive signal( EGSM 925Mhz ­ 960MHz, DCS 1805Mhz ­ 1880Mhz) is input via the antenna or coaxial connector. An antenna matching circuit is between the antenna and the connector. - 12 - 2. TECHNICAL BRIEF 2-1-2 The TX IF Modulator The TX I & Q signals from baseband IC are fed to Pin#18-21 of the TRF6150, where they are then modulated onto a TX IF by the modulator inside TRF6150. The TX IF frequency is listed as below. EGSM Band From CH 1 CH 27 CH 44 CH 92 CH 109 CH 986 CH 1003 To CH 26 CH 43 CH 91 CH 108 CH 985 CH 1002 CH 1024 AUX VCO= 2 x IF Frequency 858 MHz 852.8 MHz 858 MHz 842.4 MHz 858 MHz 842.4 MHz 858 MHz DCS Band From CH 512 CH 533 CH 550 CH 576 CH 598 CH 615 CH 663 CH 680 CH 728 CH 745 CH 793 CH 810 CH 858 CH 875 To CH 532 CH 549 CH 575 CH 597 CH 614 CH 662 CH 679 CH 727 CH 744 CH 792 CH 809 CH 857 CH 874 CH 885 AUX VCO= 2 x IF Frequency 832 MHz 837.2 MHz 832 MHz 858 MHz 837.2 MHz 858 MHz 852.8 MHz 858 MHz 852.8 MHz 858 MHz 847.6 MHz 858 MHz 847.6 MHz 858 MHz The signal TX LO IF (416 ~ 429Mhz) is produced by the AUX VCO (832 ~ 858MHz), which has been divided down by a factor of 2 . 2-1-3 The Translation Loop Transmitter The translation loop approach has many advantages over a traditional upconverter solution. A typical upconverter transmitter usually consists of an IF modulator followed by a mixer for upconversion to RF. In the translation loop transmitter, the RF transmit signal is instead generated directly by a voltage controlled oscillator (VCO), the phase of which is locked to the modulated IF reference in a fast phaselocked-loop. Because a VCO is inherently a lower-noise source than a mixer, the translation loop transmitter produces a low noise floor, so no subsequent high-selectivity filtering is necessary, and the diplexer or other post-PA filter of the conventional approach is eliminated. This saves power and cost, as the insertion loss of the duplexer is eliminated, and the output level of the power amplifier can be reduced. The transmit signal is generated directly by a external TX/RX VCO (VON1885C28DKB). In the feedback path, the RF transmit signal is mixed with the off-chip main VCO to produce the desired TXIF (416 ~ 429Mhz). This TXIF signal from the feedback path is then compared to the TXIF signal from the IF modulator at the detector. The resulting signal after passing a low pass filter drives the external TX/RX VCO. A high side injection, i.e. RF = LO - IF, is used in the EGSM band upconversion while a low side injection, i.e. RF = LO + IF, is used in the DCS band upconversion. This upconversion scheme, with appropriate TXIFs, allows for a single wide-band VCO to be used. -

File name Test point data.pdf

5. TEST POINT DATA 5. TEST POINT DATA Component Side (1-1) 1 2 3 13 4 11 6 14 12 9 10 5 7 8 16 15 - 35 - 5. TEST POINT DATA Location 1 2 3 4 5 6 7 8 9 10 11 12 13 14 J103 Q101 U202 U201 U301 U101 Q301 Q302 J301 J104 J102 U302 Y201 R104 R105 R109 D313 D102 Component Side (1-1) Battery connector : For damage or cold soldering cause power on failure P-channel MOSFET with schottky diode : For damage or cold soldering cause charger function failure Nausica_CS : analog baseband chipset (ABB) Hercrom20 : digital baseband chipset (DBB) 16Mbit flash ROM : For damage or cold soldering cause power on failure 3V, 200mA LDO regulator : For damage or cold soldering cause accessory power failure. Isolated dual transistors : For damage or cold soldering Q301A cause vibration motor Failure, Q301B cause keypad back-light failure Isolated dual transistors : For damage or cold soldering Q302A cause pre-charger indication failure, Q302B cause the LCD back-light failure Vibration motor : For damage or bad connection cause vibrator failure. System connector : For damage or cold soldering cause headset failure, trace/debug /SW download failure SIM connector : For damage or bad connection cause SIM card failure. Audio amplifier : For damage cause speaker function failure. 32.768kHz crystal : For damage cause RTC function failure. 8P4R resistor network : For damage or cold soldering cause trace/debug /SW download failure Switching diode array : For damage or cold soldering cause the surge noise by Vibrator Switching diode array : For damage or cold soldering cause the flash fast program function failure 15 16 - 36 - 5. TEST POINT DATA Component Side (1-2) 23 33 29 20 26 19 18 21 22 25 24 32 28 30 31 27 - 37 - 5. TEST POINT DATA 18 19 20 21 22 23 24 25 26 Location C223 C224 C225 C226 C227 C207 C208 C206 R208 R301 C304 C305 R110 C107 C106 R107 R207 C205 R307A R308A R307A R308A R204 R210 R215 C209 C210 Component Side (1-2) VR2B regulator (2.85V) : For damage or cold soldering cause power supply for DBB & ABB peripheral failure. VR1B regulator (2V) : For damage or cold soldering cause power supply for ABB internal logic failure VR3 regulator (2.85V) : For damage or cold soldering cause power supply for ABB analog circuits failure VR2 regulator (2.9V) : For damage or cold soldering cause power supply for Memory device failure. VR1 regulator (1.8V) : For damage or cold soldering cause power supply for DBB Core & RTC failure SIM regulator (3V/5V) : For damage or cold soldering cause power supply for SIM Interface failure VREF output (1.2V) : For damage or cold soldering cause power supply for power on failure IBIAS output : For damage or cold soldering cause power supply for Power on failure Microphone Input : For damage or cold soldering cause microphone failure 27 28 29 30 31 32 33 Ext. audio Input : For damage or cold soldering cause external audio input failure Ext. audio output : For damage or cold soldering cause external audio output failure ABB

File name Tooling list_Equipment list.pdf

9. TOOLING LIST 9. TOOLING LIST Level 1 ITEM MAGANIFY(20 TIME ) DOUBLE TAPY ( 3M) TAPE CUTER MACHINE PINCES SCREW DRIVE ELIMINATOR AIR GUN LONG FIBER CLOTH DUMMY BATTERY TEST SIM CARD ANTISTATIC GLOVE ESD COMPONENT BOX ( SMALL ) ESD COMPONENT BOX ( BIG ) ESD WRIST STRIP ESD TRAY ANTISTATIC TABLE CLOTH SCREW FEEDER HAND SCREW DRIVE FUNCTION SPEC Motic 20x~80x 8*22 mm ELM 3C HIOS CL3000 3M Model 908 15*15 CM Pick up small part Screwing Clean lens Clean hand set For testing - 57 - 9. TOOLING LIST Level 2 ITEM Buzzer/Mic Replace LED Replace Murcury Battery Replace SOLDER STATION SOLDER WIRE FLUX PASTE MAGANIFY(20 TIME ) DOUBLE TAPY ( 3M) TAPE CUTER MACHINE PINCES SCREW DRIVE ELIMINATOR AIR GUN LONG FIBER CLOTH DUMMY BATTERY PRINTER SCANNER PC TEST SIM CARD ANTISTATIC CLOTH ANTISTATIC GLOVE ANTISTATIC SHOES ESD COMPONENT BOX ( SMALL ) ESD COMPONENT BOX ( BIG ) CLEANNER CLEANNER BOTTLE ESD WRIST STRIP ESD TRAY ANTISTATIC TABLE CLOTH SCREW FEEDER SOLDER IRON JIG HAND SCREW DRIVE FUNCTION SPEC Pick up small part Screwing Clean lens Clean hand set For testing Weller WES50 Kester 0.6mm Fmkanc32-200 Motic 20x~80x 8*22 mm ELM 3C HIOS CL3000 3M Model 908 15*15 CM - 58 - 9. TOOLING LIST Level 3 ITEM Buzzer/Mic Replace LED Replace Murcury Battery Replace SOLDER STATION SOLDER WIRE FLUX PASTE MAGANIFY(20 TIME ) DOUBLE TAPY ( 3M) TAPE CUTER MACHINE PINCES SCREW DRIVE ELIMINATOR AIR GUN LONG FIBER CLOTH DUMMY BATTERY PRINTER SCANNER PC TEST SIM CARD ANTISTATIC CLOTH ANTISTATIC GLOVE ANTISTATIC SHOES ESD COMPONENT BOX ( SMALL ) ESD COMPONENT BOX ( BIG ) CLEANNER CLEANNER BOTTLE ESD WRIST STRIP ESD TRAY ANTISTATIC TABLE CLOTH SCREW FEEDER SOLDER IRON JIG HAND SCREW DRIVE FUNCTION SPEC Pick up small part Screwing Clean lens Clean hand set For testing Weller WES50 Kester 0.6mm Fmkanc32-200 Motic 20x~80x 8*22 mm ELM 3C HIOS CL3000 3M Model 908 15*15 CM - 59 - 10. EQUIPMENT LIST 10. EQUIPMENT LIST Level 2 ITEM 1. PC 2. Dummy Battery 3. Multimeter 4. OSC SCOPE 5. SPECTRUM FUNCTION SPEC Level 3 ITEM 1. HP 8960/HP 8922/R&S CMU200 2. HP 66311B (DC Power) 3. PC 4. GPIB Card (HP82350A) 5. Dummy Battery 6. Multimeter 7. OSC SCOPE 8. SPECTRUM 9. HP E6392B FUNCTION SPEC - 60 -