File name KX-TC1035BXW.pdfORDER NO. KM40012753C3
Telephone Equipment
KX-TC1035BXW
Cordless Phone White Version (for Asia, Middle Near East and Other areas)
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SPECIFICATIONS
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1. STANDARD BATTERY LIFE
If your Panasonic battery is fully charged;
While in use (TALK) While not in use (Stand-by) Up to about 6 hours Up to about 30 days
- Battery life may vary depending on usage conditions and ambient temperature. - Clean the handset and the base unit charge contacts with a soft, dry cloth.
Clean if the unit is subject to grease, dust or high humidity. Otherwise the battery may not charge propery.
- If the battery is fully charged, you do not have to place the handset on the base
unit until the RECHARGE indicator flashes. This will maximize the battery life.
- The battery cannot be overcharged.
2. LOCATION OF CONTROLS
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3. CONNECTION
1. Connect as shown.
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- USE ONLY WITH Panasonic ACADAPTOR PQLV1BXZ. - The AC adaptor must remain connected at all times. (It is normal for the adaptor to feel warm during use.) - When more than one unit is used, the units may interfere with each other. To prevent or reduce interference, please leave ample space between the base units.
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3.1. Adding Another Phone
This unit will not function during a power failue. To connect a standard telephone on the same line, use a T-adaptor.
4. DISASSEMBLY INSTRUCUTIONS
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Ref. No. Procedure Shown in Fig -. 1 2 3 4 5 6 1 1, 2 1, 2, 3 4 4, 5 4-6 1 2 3 4 5 6
To remove -. Lower Cabinet Main Printed Circuit Board Charge Terminal Rear Cabinet Main Printed Circuit Board
Remove -. Screws (3 × 14)... (A) × 5 Screws (3 × 14)... (B) × 1 Screws (3 × 10)... (C) × 2 Remove the battery compartment cover Screws (2.6 × 14)...(E) × 2 Screws (2.6 × 14)...(F) × 1
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5. HOW TO REPLACE FLAT PACKAGE IC
5.1. Preparation
- SOLDER
Sparkle Solder 115A-1, 115B-1 or Almit Solder KR-19,KR-19RMA
- Soldering iron
Recommended power consumption will be between 30 W to 40 W. Temperature of Copper Rod 662 ± 50°F (350 ± 10°C) (An expert may handle between 60 W to 40 W iron, but beginner might damage foil by overheating.)
- Flux
HI115 Specific gravity 0.863 (Original flux will be replaced daily.)
5.2. Procedure
1. Temporary fix FLAT PACKAGE IC by soldering on two marked 2 pins.
*Most important matter is accurate setting of IC to the corresponding soldering foil. 2. Apply flux for all pins of FLAT PACKAGE IC.
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3. Solder employing specified solder to direction of arrow, as sliding the soldering iron.
5.3. Modification Procedure of Bridge
1. Re-solder slightly on bridged portion. 2. Remove remained solder along pins employing soldering iron as shown in
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below figure.
6. CPU DATA (BASE UNIT)
6.1. IC201
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7. CPUDATA (HANDSET)
7.1. IC901
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8. E |